LED is a light-emitting diodes (Light Emitting Diode, LED) for short, also known as light-emitting diodes, such as a semiconductor device is generally light, display board, it is not only efficient electrical energy directly into light can and have the most up to tens of thousands of hours to 10 million hours of service life, while not as traditional light bulbs with fragile, and can power-saving advantages.

However, no matter what kind of high power led need for different types of well-designed package, because only the end product can become a good package, in order to put into practical application.

1. Why should we LED encapsulation? LED package is the role of the outer leads connected to the super bright led manufacturer chip, the electrodes can not only protect the LED chip, but also play a role in improving luminous efficiency. Therefore, the output LED package is not just the completion of electrical signals, more importantly, is to protect the die work, the output function of visible light. LED package can be seen both electrical parameters, another optical parameters of the design and technical requirements, is not a simple task.

2.LED Packaging Equipment LED packaging requirements due to the higher, therefore, both the-line high power led bulbs or SMD LED, must use a high-precision solid crystal machine, because the LED chip into the package location is accurate, it will directly affect the whole package the device luminous efficiency. If the chip position within the reflector cup there is a discrepancy can not be completely reflected light out of a direct impact on LED brightness. However, using an advanced PR System (pre-image recognition system) solid crystal machine, regardless of differences in the quality of lead frame, LED chip can still be accurately welded to scheduled location.

3.LED Package According to different applications, different dimensions, thermal programs and glow. LED packaging a variety of forms. At present, LED packages classified mainly according to Lamp-LED, TOP-LED, Side-LED, SMD-LED, ultra bright leds, High-Power-LED, Flip Chip-LED, etc.

Lamp-LED (vertical LED) Lamp-LED appears that the early-line LED, it is the package in the form of using potting. Casting process is the first LED-forming liquid epoxy resin into the mold cavity, and then insert a good bonding LED stent, into the oven for epoxy curing, will be from the mold cavity from the LED that is out of shape. Because of the manufacturing process is relatively simple, low cost, has a higher market share.

SMD-LED (surface mount LED) SMD LED is affixed to the surface of circuit board, suitable for SMT processing, can be reflow, a good solution to the brightness, viewing angle, smoothness, reliability, consistency and other issues, using lighter materials, PCB board and reflective layer , improved to remove the-line bright leds manufacturer heavy carbon steel pin, so that shows the need filled epoxy reflector less aims to reduce size, lower weight. In this way, surface-mount LED products can easily reduce the weight by half, eventually applied more perfect.